| Soldering imperfections
fall into the following categories:
- Dry joints due to insufficient solder
- Bridging/Shorts due to surplus solder
- Voiding due to gas bubbles within the solder
- Misplacement/Misalignment due to inaccurate placement of components
The ease of seeing these defects depends on the
image details. Defects as bridging and gross misalignment, are detectable
with microscopes. Others, such as voiding, requires X-ray with a
resolution down to one micron, and power in excess of 100W, particularly
for devices such as micro-BGAs.
To detect dry joints high resolution (1 micron)
high magnification (100X to 5.000X), complex sample manipulation
(to tilt and rotate the PCB or the imaging system), and sophisticated
image-processing software is required. XT V 160 combines all these
into one very user-friendly system.
Wide range of uses
Any OEM and supplier of electronic subsystems in
consumer electronics, automotive, aerospace can enrich its inspection
process by adopting X-ray and CT inspection systems.
Electronic and electrical components
Inspection/Detection of:
- Broken wedge bonds
- Lifted ball bonds
- Wire sweep
- Die attach
Populated and unpopulated PCBs
- View surface mount defects i.e. misaligned
devices, solder joint porosity, bridging
- Detailed inspection of vias, through hole plating and multi-layer
alignment
- BGA and CSP inspection
- Non-lead solder inspection
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