Electronics Application

1. BGA

BGA - Oblique view Imaged at 80 kV

BGA - Single solder ball Imaged at 80 kV

BGA - View

BGA

2. CT Stacked IC assembly

720 views, 120Kv, 5 micron focal spot, 16 micron voxels.

Image of intermediate wafer extracted from the 3D voxel information.

Industrial Computed Tomography

1 . Light alloy casting

Side view 350kV

Prototype system

3D rendering Prototype system

2D CT Slice

2 . Light alloy casting - Small casting

3 . CT aircraft turbine blade

Scanned radiograph Scanned using 1-D linear detector

2D section 1 minute acquisition time - 350kV

2D section 1 minute acquisition time - 350kV

2D section 1 minute acquisition time - 350kV

Radiograph Scanned using 1-D linear detector

Photograph

4 . Ceramic foam

3D reconstruction

Horizontal 2D slice

5 . Powder compact

Horizontal 3D Slice

Vertical 3D Slice

Semi-Transparent 3D Render

6 . Ancient clay pot

3D CT volume analysis tools applied to detect and display defects

CT volume after reconstruction

Slice shows porosity (dark) and inclusions (light)

Photograph

7 . Antikythera

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